发明名称 |
CIRCUIT BOARD WITH VIA TRACE CONNECTION AND METHOD OF MAKING THE SAME |
摘要 |
<p>Various circuit boards and methods of manufacturing the same are disclosed. In one aspect, a method of manufacturing is provided that includes forming a first interconnect layer of a circuit board. The first interconnect layer includes a first conductor trace with a first segment that does not include a via land. A first via is formed on the first segment.</p> |
申请公布号 |
EP2513956(A1) |
申请公布日期 |
2012.10.24 |
申请号 |
EP20100795531 |
申请日期 |
2010.12.11 |
申请人 |
ATI TECHNOLOGIES ULC |
发明人 |
LEUNG, ANDREW, KW;MCLELLAN, NEIL;LOW, YIP, SENG |
分类号 |
H01L21/48;H01L23/498 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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