| 发明名称 |
Power amplifier |
| 摘要 |
According to an embodiment, a power amplifier includes: an MMIC substrate; a high frequency probe pad disposed on the MMIC substrate; and a metal plate disposed on the MMIC substrate so as to adjoin to the high frequency probe pad, and connected to an MMIC external circuit via a bonding wire. |
| 申请公布号 |
EP2515435(A2) |
申请公布日期 |
2012.10.24 |
| 申请号 |
EP20110194872 |
申请日期 |
2011.12.21 |
| 申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
NG, CHOON YONG;TAKAGI, KAZUTAKA |
| 分类号 |
H03F3/189;H01L21/66;H01L23/00;H01L23/66;H03F1/56;H03F3/195;H03F3/24;H03F3/60 |
主分类号 |
H03F3/189 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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