| 摘要 |
An integrated circuit including a die of the integrated circuit, the die including an insulating layer, light emitting diodes, a semiconductor layer, and a control module. The insulating layer includes a first side and a second side. The second side is opposite to the first side. The light emitting diodes are arranged on the first side of the insulating layer. The semiconductor layer is arranged adjacent to the second side of the insulating layer. The light emitting diodes are connected to the semiconductor layer using connections from the first side of the insulating layer to the second side of the insulating layer. The control module is arranged on the semiconductor layer. The control module is configured to output pulse width modulated pulses to the light emitting diodes via the connections. |
