发明名称 |
POLYMER FOR PHOTORESIST AND RESIN COMPOSITIONS THEREFOR |
摘要 |
<p>A polymeric compound for photoresist of the invention includes at least one monomer unit represented by following Formula (I): <CHEM> wherein R<1>, R<2>, R<3>, R<4> and R<5> are the same or different and are each a hydrogen atom or a methyl group; m, p and q each denote an integer of from 0 to 2; and n denotes 0 or 1, where the hydroxyl group and carbonyloxy group extending from a principle chain in the formula are independently combined with either of two carbon atoms on the far-left portion of the rings. By using the polymeric compound for photoresist as a base of a photoresist, the resulting photoresist exhibits well-rounded adhesion to substrates and resistance to etching.</p> |
申请公布号 |
EP1354897(B1) |
申请公布日期 |
2012.10.24 |
申请号 |
EP20010270561 |
申请日期 |
2001.12.11 |
申请人 |
DAICEL CHEMICAL INDUSTRIES, LTD. |
发明人 |
FUNAKI, YOSHINORI;TSUTSUMI, KIYOHARU;INOUE, KEIZO;ADACHI, TOMOKO |
分类号 |
C08F20/28;C07D305/14;C07D307/93;C07D311/94;C07D313/06;C07D313/20;G03F7/039 |
主分类号 |
C08F20/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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