发明名称 Hologram pattern forming method
摘要 <p>There is provided a hologram pattern forming method and a method for manufacturing film having hologram pattern which enable to reduce a manufacturing cost for forming the hologram pattern, while suppressing a cost of a mother die. This includes a coating step of coating a self-curable material on a base material, an overlapping step of overlapping an uncured self-curable material which is applied on the base material in the coating step, on an uneven hologram pattern which is formed on a resin mother die, and a peeling step of peeling the self-curable material on which, the hologram pattern is transferred in the overlapping step, and the resin mother die.</p>
申请公布号 EP2166418(B1) 申请公布日期 2012.10.24
申请号 EP20080790113 申请日期 2008.07.01
申请人 TOYO SEIKAN KAISHA, LTD. 发明人 AKIMOTO, MUNEKAZU;HIRATA, KATSUYUKI
分类号 G03H1/20;B65D25/20 主分类号 G03H1/20
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