| 摘要 |
An electronic component mounting configuration in which an electronic component chip having a plurality of protrusion-shaped electrodes distributed on its entire mounting surface is mounted through protrusion-shaped electrodes on a printed circuit board is provided which is capable of improving reliability of an electronic component by relieving thermal stress. The solder bumps are arranged so that intervals between solder bumps adjacent to one another become smaller from a central portion of a mounting surface of the electronic component chip toward the peripheral portion thereof. For example, an interval between the solder bump 1A arranged in the central portion of the semiconductor chip and the solder bump 1B arranged in an outer side thereof, adjacent to each other, is set to a pitch of P1. An interval between the solder bump 1B and the solder bump 1C formed arranged in an outer side thereof, adjacent to each other, is set to a pitch of P2 and an interval between the solder bump 1C and the solder bump 1D formed arranged in an outer side thereof, adjacent to each other, is set to a pitch of P3 (P1>P2>P3). |
