发明名称 Semiconductor photodiode device and manufacturing method thereof
摘要 A semiconductor photodiode device includes a semiconductor substrate, a first buffer layer containing a material different from that of the semiconductor substrate in a portion thereof, a first semiconductor layer formed above the buffer layer and having a lattice constant different from that of the semiconductor substrate, a second buffer layer formed above the first semiconductor layer and containing an element identical with that of the first semiconductor layer in a portion thereof, and a second semiconductor layer formed above the buffer layer in which a portion of the first semiconductor layer is formed of a plurality of island shape portions each surrounded with an insulating film, and the second buffer layer allows adjacent islands of the first semiconductor layer to coalesce with each other and is in contact with the insulating film.
申请公布号 US8294213(B2) 申请公布日期 2012.10.23
申请号 US20100838445 申请日期 2010.07.17
申请人 MIURA MAKOTO;SAITO SHINICHI;LEE YOUNGKUN;ODA KATSUYA;HITACHI, LTD. 发明人 MIURA MAKOTO;SAITO SHINICHI;LEE YOUNGKUN;ODA KATSUYA
分类号 H01L21/00;H01L21/331;H01L27/12 主分类号 H01L21/00
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