发明名称 Current rectifying element, memory device incorporating current rectifying element, and fabrication method thereof
摘要 In a current rectifying element (10), a barrier height &phgr;A of a center region (14) of a barrier layer (11) in a thickness direction thereof sandwiched between a first electrode layer (12) and a second electrode layer (13) is formed to be larger than a barrier height &phgr;B of a region in the vicinity of an interface (17) between the barrier layer (11) and the first electrode layer (12) and an interface (17) between the barrier layer (11) and the second electrode layer (13). The barrier layer (11) has, for example, a triple-layer structure of barrier layers (11a), (11b) and (11c). The barrier layers (11a), (11b) and (11c) are, for example, formed by SiN layers of SiNx2, SiNx1, and SiNx1 (X1<X2). Therefore, the barrier layer (11) has a barrier height in which the shape changes in a stepwise manner and the height of the center region 14 is large.
申请公布号 US8295123(B2) 申请公布日期 2012.10.23
申请号 US20080669174 申请日期 2008.07.11
申请人 TAKAGI TAKESHI;MIKAWA TAKUMI;ARITA KOJI;IIJIMA MITSUTERU;OKADA TAKASHI;PANASONIC CORPORATION 发明人 TAKAGI TAKESHI;MIKAWA TAKUMI;ARITA KOJI;IIJIMA MITSUTERU;OKADA TAKASHI
分类号 G11C13/00 主分类号 G11C13/00
代理机构 代理人
主权项
地址