摘要 |
According to one embodiment, a resistance change memory includes a stacked layer structure stacked on a semiconductor substrate in order of a first conductive line, a first variable resistance element, a second conductive line, a second variable resistance element, . . . a n-th conductive line, a n-th variable resistance element and a (n+1)-th conductive line, where n is a natural number equal to or larger than 2, and a first to a n-th drivers which drives the first to the (n+1)-th conductive lines. The odd-numbered conductive lines are extends in a first direction along a surface of the semiconductor substrate. The even-numbered conductive lines are extends in a second direction along the surface of the semiconductor substrate. Sizes of the first to (n+1)-th drivers become large gradually from the first driver to the (n+1)-th driver. |