发明名称 PHOTORESIST COMPOSITION
摘要 <p>PURPOSE: A photoresist composition and a manufacturing method of photoresist patterns using the same are provided to include a resin which becomes soluble in an alkali aqueous solution by the action of acid. CONSTITUTION: A photoresist composition includes a first salt represented by chemical formula I, a second salt represented by chemical formula II-0, and a resin. The resin is insoluble or hardly solution in an alkali aqueous solution and becomes soluble in the alkali aqueous solution by the action of acid. In chemical formula I, R1 and R2 are respectively fluorine atoms or C1-C6 perfluoroalkyl groups; X1 is a C1-C17 divalent saturated hydrocarbon group, and one or more hydrogen atoms in the hydrocarbon group are substitutable with fluorine atoms and one or more -CH2- in the hydrocarbon group are substitutable with -O- or -CO-; s1 is 1 or 2; t1 is 0 or 1; the sum of s1 and t1 is 1 or 2; R3 is a C6-C18 aromatic hydrocarbon group or a C1-C12 saturated hydrocarbon group, and one or more hydrogen atoms in the aromatic hydrocarbon group are substitutable with C1-C6 alkyl groups or nitro groups and one or more -CH2- in the aromatic hydrocarbon group is substitutable with -O-; u1 is the integer of 0 to 8; and Z1+ is an organic cation.</p>
申请公布号 KR20120116864(A) 申请公布日期 2012.10.23
申请号 KR20120037261 申请日期 2012.04.10
申请人 SUMITOMO CHEMICAL CO., LTD. 发明人 ICHIKAWA KOJI;SAKAMOTO HIROMU;MUKAI YUICHI
分类号 G03F7/038;G03F7/004 主分类号 G03F7/038
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