发明名称 Double laser drilling of a printhead integrated circuit attachment film
摘要 A method of fabricating an apertured polymeric film. The method comprising the steps of: (a) masking a polymeric film with a first mask having first laser transmission zones defined therein; (b) laser-ablating first apertures through the polymeric film using the first mask; (c) masking the film with a second mask having second laser transmission zones defined therein, each second zone being aligned with a corresponding first aperture, and each second zone having greater perimeter dimensions than the corresponding first aperture; and (d) reaming the first apertures by laser-ablating the polymeric film using the second mask, the reamed first apertures defining second apertures in the film.
申请公布号 US8293057(B2) 申请公布日期 2012.10.23
申请号 US20080049371 申请日期 2008.03.17
申请人 RAMACHANDRA NAGESH;FISHBURN JENNIFER MIA;SHARP PAUL TIMOTHY;WILLIAMS SUSAN;PAPWORTH PAUL ANDREW;FIELDER SIMON;SILVERBROOK KIA;ZAMTEC LIMITED 发明人 RAMACHANDRA NAGESH;FISHBURN JENNIFER MIA;SHARP PAUL TIMOTHY;WILLIAMS SUSAN;PAPWORTH PAUL ANDREW;FIELDER SIMON;SILVERBROOK KIA
分类号 B32B38/00;B32B38/04 主分类号 B32B38/00
代理机构 代理人
主权项
地址
您可能感兴趣的专利