发明名称 On-wafer butted microbolometer imaging array
摘要 An apparatus and method for assembling a large microbolometer infrared imaging array from sub-arrays, including the step of forming a sub-array assembly of independent imaging arrays on the silicon wafer as the imaging sensor is being processed, whereby seams or gaps in a resulting image are avoided.
申请公布号 US8294099(B2) 申请公布日期 2012.10.23
申请号 US20100757247 申请日期 2010.04.09
申请人 BLACKWELL, JR. RICHARD J.;BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC. 发明人 BLACKWELL, JR. RICHARD J.
分类号 G01J5/00 主分类号 G01J5/00
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