发明名称 |
On-wafer butted microbolometer imaging array |
摘要 |
An apparatus and method for assembling a large microbolometer infrared imaging array from sub-arrays, including the step of forming a sub-array assembly of independent imaging arrays on the silicon wafer as the imaging sensor is being processed, whereby seams or gaps in a resulting image are avoided. |
申请公布号 |
US8294099(B2) |
申请公布日期 |
2012.10.23 |
申请号 |
US20100757247 |
申请日期 |
2010.04.09 |
申请人 |
BLACKWELL, JR. RICHARD J.;BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC. |
发明人 |
BLACKWELL, JR. RICHARD J. |
分类号 |
G01J5/00 |
主分类号 |
G01J5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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