SUBSTRATE PROCESSING METHOD, RECORDING MEDIUM WHICH RECORDED PROGRAM FOR EXECUTING SUBSTRATE PROCESSING METHOD, SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING SYSTEM

摘要

PURPOSE: A wafer processing method, a recording medium for executing the same, a wafer processing apparatus, and a wafer processing system are provided to regularly maintain a width size of an area from which a coating layer is eliminated in a peripheral portion of a wafer without need to install a position determination sensor for each module. CONSTITUTION: A rinse fluid supply part(80) supplies a rinse liquid on a surface of a peripheral portion of a wafer(W) held and supported by a spin chuck(61). A coating film on a location where the rinse liquid is provided is selectively removed. A detection part is installed in a wafer transfer part. A detection part detects the location of the peripheral portion of the wafer when the wafer is transferred by the wafer transfer part in advance. The detection part determines the location of the rinse fluid supply part based on the detected location.