| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a circuit connection material which has a high adhesive force even after being left in a high-temperature environment although being a radical polymerization type adhesive capable of low temperature rapid solidification of permanent connection, and sufficiently inhibits separation bubbles from being formed on the interface between a circuit member and the circuit connection material, and to provide a circuit connection structure using the circuit connection material. <P>SOLUTION: A circuit connection material for electrically connecting two circuit members facing each other contains (A) a thermoplastic resin, (B) a polyurethane resin, (C) a radical polymerizable compound and (D) a radical polymerization initiator. (B) the polyurethane resin is obtained by making a diol component containing at least diol having an ester bond and a diisocyanate component react with each other. The compounding amount of (B) the polyurethane resin is 1.5 to 8.5 mass% based on the total amount of (A) the thermoplastic resin, (B) the polyurethane resin and (C) the radical polymerizable compound. <P>COPYRIGHT: (C)2013,JPO&INPIT |
