| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a technology of minimizing damage on the mounting table surface when cleaning a plasma processing apparatus of a substrate by means of plasma without using a dummy substrate. <P>SOLUTION: After plasma etching treatment, interior of the vacuum vessel 1 in a plasma etching apparatus is cleaned by means of plasma P while exposing the surface of a susceptor 3, and reaction products A adhering to the interior of the vacuum vessel 1 are removed. At this time, a DC voltage is applied to the plasma P. Since ion energy of the plasma P can be reduced while obtaining high density plasma P, damage on the surface of the susceptor 3 can be minimized while performing a good cleaning. <P>COPYRIGHT: (C)2013,JPO&INPIT |
