| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a circuit board having a uniformly high joining strength at a low cost when being joined at a high temperature when the circuit board is manufactured. <P>SOLUTION: A laminating structure is composed to laminate metal plates on upper and lower parts of a ceramic board respectively. The multiple number of laminating structures are laminated by sandwiching spacers, and made to be a substantially rectangular body 100 to be pressured. Pillar members 53 are provided in three rows three by three in a form surrounding three sides of a vertical cross section (rectangle) in a laminating direction in the body 100 to be pressured. Plate-like vertical spacers 31, 32 are provided respectively so as to be in contact with these side (side face) on the body 100 to be pressured on the upper side and left side of the body 100 to be pressured. After pressure is applied on the body 100 to be pressured, the vertical spacers 31, 32 are extracted. <P>COPYRIGHT: (C)2013,JPO&INPIT |
