| 发明名称 |
INTERPOSER SUBSTRATE, MANUFACTURING METHOD OF THE INTERPOSER SUBSTRATE, AND ELECTRONIC APPARATUS |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an interposer substrate which secures a clearance between an electronic component and an interposer substrate even through the clearance between the electronic component and the interposer substrate is narrowed. <P>SOLUTION: An interposer substrate includes: a substrate body 11; wiring patterns 12, each of which is provided on a surface of the substrate body 11 and has an electrode pad 15 for connecting with a protruding terminal 32 of an electronic component 30; and metal films 13, each of which is selectively formed around the electrode pad 15 of the wiring pattern 12 and has lower solder wettability than the electrode pad 15. <P>COPYRIGHT: (C)2013,JPO&INPIT |
| 申请公布号 |
JP2012204700(A) |
申请公布日期 |
2012.10.22 |
| 申请号 |
JP20110069025 |
申请日期 |
2011.03.26 |
| 申请人 |
FUJITSU LTD |
发明人 |
SHIMIZU KOZO;IMAIZUMI NOBUHIRO |
| 分类号 |
H01L21/60;H01L23/12;H01L23/32 |
主分类号 |
H01L21/60 |
| 代理机构 |
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