| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a formation method of copper wiring capable of improving copper wiring conductivity and suppressing degradation caused by aging, a manufacturing method of a wiring board, and the wiring board. <P>SOLUTION: A formation method of copper wiring comprises: a pattern formation step of applying a dispersion liquid 12 in which copper particles 14 with a particle size of 100 nm or above are dispersed to a board 10 to form a wiring pattern on the board 10; a drying step of drying the wiring pattern at a temperature less than 150°C; a pressurization step of pressurizing the wiring pattern after the drying step; a heating step of heating the wiring pattern after the pressurization step; and a reduction processing step of reducing the wiring pattern after the heating step. There are also provided a manufacturing method of a wiring board and the wiring board. <P>COPYRIGHT: (C)2013,JPO&INPIT |
