| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a Co-Si based copper alloy sheet which has superior solder wettability, and also has reduced pin holes upon soldering. <P>SOLUTION: The Co-Si based copper alloy sheet comprises, by mass, 0.5 to 3.0% Co and 0.1 to 1.0% Si, and the balance Cu with inevitable impurities, and satisfies ratio of (surface roughness Ra(RD) in a direction parallel to a rolling direction)/(surface roughness Ra(TD) in a direction orthogonal to a rolling direction)≤0.8. <P>COPYRIGHT: (C)2013,JPO&INPIT |
