| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a technique capable of precisely estimating the lifetime of a semiconductor device and also estimating the lifetime in as a short time as possible. <P>SOLUTION: The lifetime estimation method includes the processes of: (a) preparing a reference lifetime curve based upon parameters of a junction temperature stress amount ΔT<SB POS="POST">wb</SB>as a temperature stress amount of a junction part for joining a semiconductor chip included in the semiconductor device and metal wiring 12 to each other, and a cycle number Nf corresponding to the lifetime of the semiconductor device; and (b) estimating the lifetime of the semiconductor device using the reference lifetime curve. <P>COPYRIGHT: (C)2013,JPO&INPIT |
