PRESSURE-SENSITIVE ADHESIVE TAPE FOR SEMICONDUCTOR WAFER PROCESSING

摘要

PROBLEM TO BE SOLVED: To provide a pressure-sensitive adhesive tape for semiconductor wafer processing which does not contain a surfactant and an organic tin compound as curing accelerator in a pressure-sensitive adhesive layer, exhibits superior prevention performance concerning the surface adhesive deposit and the lateral surface adhesive deposit and further exhibits superior prevention performance concerning the LM (Laser Mark) adhesive deposit.

SOLUTION: There is provided the tape for semiconductor wafer processing in which at least one layer of pressure-sensitive adhesive layer is laminated on a base film, wherein the pressure-sensitive adhesive layer contains a radiation curable pressure-sensitive adhesive and an organic metallic compound of a metal element of the fourth group in a periodical table of element is contained in the proportion of 0.001 to 10 wt.% with respect to the whole weight of the radiation curable pressure-sensitive adhesive.

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