发明名称 SUBSTRATE PROCESSING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To inhibit adhesion of particles and the like to a substrate to uniform a processing environment of the substrate by controlling a supply amount of a drying gas supplied from gas supply means. <P>SOLUTION: In a substrate carrying-out operation in a step S4, whether the inside of a chamber 11 is to be a positive pressure or a negative pressure is determined (step S42). When it is determined that the inside of the chamber 11 is to be the positive pressure, a control part 45 increases a supply amount of dry air by adjusting an inverter in a generator built in a dry air supply device 31, and closes openings of an electric damper 37 and a flow control valve 43 (step S43). When it is determined that the inside of the chamber 11 is to be the negative pressure, the control part 45 decreases the supply amount of dry air by adjusting the inverter in the generator built in the dry air supply device 31, and opens the openings of the electric damper 37 and the flow control valve 43 (step S44). <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012204417(A) 申请公布日期 2012.10.22
申请号 JP20110065128 申请日期 2011.03.24
申请人 DAINIPPON SCREEN MFG CO LTD 发明人 AIHARA TOMOAKI
分类号 H01L21/304;G02F1/13;G02F1/1333 主分类号 H01L21/304
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