发明名称 PACKAGE FOR LIGHT EMITTING DEVICE AND THE LIGHT EMITTING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a package for a light emitting device which improves the luminous efficiency and the heat radiation performance, and to provide a light emitting device using the package. <P>SOLUTION: A package for a light emitting device includes: a substrate 31 having an installation surface 31a on which a light emitting element 2 is installed; and a reflection part (a reflection frame 32 or a porous layer 33) disposed around the light emitting element 2 and reflecting the outgoing light of the light emitting element 2. The heat conductivity of the substrate 31 is higher than those of the reflection parts (32, 33) and the reflection rates of the reflection parts (32, 33) are higher than that of the substrate 31. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012204767(A) 申请公布日期 2012.10.22
申请号 JP20110070303 申请日期 2011.03.28
申请人 SANYO ELECTRIC CO LTD;SANYO DENPA KOGYO KK 发明人 HITOMI TAKUMA;KUBOTA MASA
分类号 H01L33/48;H01L23/02;H01L23/08 主分类号 H01L33/48
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