| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a compact semiconductor cooling device capable of improving cooling performance by efficiently using cooling air by a cooling fan. <P>SOLUTION: A first cooler 4 having a wide cooling air width with respect to a cooling air flow length and a second cooler 5 having a cooling air width smaller than that of the first cooler 4 are arranged so that cooling air directions are similar and no heat is exchanged therebetween. The semiconductor elements 7, 8 and 9 of an inverter circuit are attached to the first cooler 4, and the semiconductor element 10 of a brake chopper circuit is attached to the second cooler 5. Cooling air by a cooling fan 6 having a cooling air direction perpendicular to the cooling air direction of the cooler is distributed to the first cooler 4 and the second cooler 5 via a wind channel 2 having an air rectifying guide 3, and the heat exchange with the semiconductors is performed. <P>COPYRIGHT: (C)2013,JPO&INPIT |
