发明名称 ADHESIVE LAMINATE
摘要 <P>PROBLEM TO BE SOLVED: To provide an adhesive laminate good in low temperature heat sealability and having a special feature of hardly causing blocking. <P>SOLUTION: The adhesive laminate, which is a heat and pressure adhesion-type, is prepared by mixing a filler in an adhesive resin composition including an aqueous emulsion prepared by emulsifying an adhesive polymer using a high polymer emulsifier, then by coating the mixture on the surface of a film or sheet-shaped substrate, wherein the contents of the high polymer emulsifier and the filler to 100 pts.wt. of the adhesive resin are respectively 2-40 pts.wt. and 0.1-5 pts.wt., and moreover there is a predetermined relationship between the thickness L1 of the adhesive layer comprised of the adhesive resin composition and the volume average particle diameter L2 of the filler. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012201839(A) 申请公布日期 2012.10.22
申请号 JP20110069368 申请日期 2011.03.28
申请人 CHUO RIKA KOGYO CORP 发明人 SUGYO YASUNARI;IRIE YASUHIRO
分类号 C09J7/02;B32B27/00;C09J11/00;C09J11/08;C09J201/00 主分类号 C09J7/02
代理机构 代理人
主权项
地址