| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electric copper plating additive which forms a uniform plating film from low current density parts to high current density parts and imparts a lustrous shine to the film, and which is not depleted when not in use, and to provide an electric copper plating bath containing the additive. <P>SOLUTION: The electric copper plating additive comprising a block polymer compound represented by general formula (1) is added to the electric copper plating bath. In formula (1), R represents a linear or branched alkyl group or alkenyl group having 1 to 15 carbon number, m is an integer from 1 to 30, and n is an integer from 1 to 40. <P>COPYRIGHT: (C)2013,JPO&INPIT |
