| 摘要 |
<P>PROBLEM TO BE SOLVED: To suppress production of marks and smear on the internal surface of a mold due to transfer of a bleeding mold release agent component and production of smear and voids on a molded package surface, in package molding using an epoxy resin composition for sealing. <P>SOLUTION: An epoxy resin composition for sealing includes an epoxy resin, a curing agent, an inorganic filler and a mold release agent, wherein the mold release agent includes (a) oxidized polyethylene, (b) natural carnauba wax and (c) at least one of hydroxystearic acid amide and montanic acid bisamide and the component (a) accounts for ≤50 mass% of the total mold release agent. <P>COPYRIGHT: (C)2013,JPO&INPIT |
