| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a technique capable of restraining occurrence of a water mark on a substrate due to mist and the like in a substrate processing device and a substrate processing method for cooling and solidifying a liquid film formed on the substrate. <P>SOLUTION: A liquid film formed on a surface Wf of a substrate W held by a spin base 23 is frozen by cooling gas of a lower temperature than a solidification point of liquid constituting the liquid film. A nozzle 3 emitting the cooling gas is scanned by a rotation arm 35 from a rotation center AO of the substrate to a substrate peripheral edge. At other timings, the nozzle 3 is made standby at a standby position (dotted lines) away from an upper part of the substrate, and the cooling gas is emitted at a low flow rate for idling. The emitted cooling gas is recovered by a gas recovery unit 300 provided immediately below the nozzle 3 at the standby position, so as to prevent the cooling gas from flowing in a processing space SP. <P>COPYRIGHT: (C)2013,JPO&INPIT |
