MANUFACTURING METHOD OF FLEXIBLE PRINTED CIRCUIT BOARD USING POLYIMIDE INK AND POLYIMIDE SHEET

摘要

PURPOSE: A manufacturing method of a flexible printed circuit board using polyimide ink is provided to simplify a manufacturing process by removing the process of lamination, light exposure, corrosion and exfoliation from the manufacturing process of the flexible printed circuit board. CONSTITUTION: A polyimide film(100) is formed by spreading polyimide ink on one surface of glass or PET(1). A conductive pattern(110) is formed by printing copper paste on the upper surface of the polyimide film. The polyimide film with the conductive pattern is separated from the glass or the PET. A coverlay(120) is formed by spreading and drying the polyimide ink for protecting the conductive pattern formed on the polyimide film.