| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve a lifetime of a bump by inhibiting bump fatigue. <P>SOLUTION: A method comprises forming recesses 25b on a surface side of an encapsulation layer 25 of a semiconductor wafer 111 on which the encapsulation layer 25 is provided above one surface, and filling a low elastic material 26 having an elastic modulus lower than the elastic modulus of the encapsulation layer 25 in the recesses 25b to form bumps 27 above the one surface of the semiconductor wafer 111. <P>COPYRIGHT: (C)2013,JPO&INPIT |
