| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve electrical connection reliability in an electronic component built-in wiring board. <P>SOLUTION: A wiring board 10 comprises a substrate 100 having a cavity R10, an electronic component 200 housed in the cavity R10 and having electrodes 210, 220, an adhesion layer 400 (insulation layer) formed on the electronic component 200, via conductors 401b, 402b composed of conductors formed in holes 401a, 402a (via holes) formed in the adhesion layer 400, and a conductor layer 301 electrically connected with the electrodes 210, 220 through the via conductors 401b, 402b. The conductor layer 301 includes a planar conductor pattern immediately above an outer edge of at least one of the electrodes 210, 220. <P>COPYRIGHT: (C)2013,JPO&INPIT |
