| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a solid state imaging device which has a partition layer provided for preventing cross talk, inhibits deterioration in sensitivity characteristics and achieves an excellent picture quality even when a size of a light-receiving part is downsized for higher picture quality. <P>SOLUTION: A solid state imaging device comprises: a semiconductor substrate 11; a plurality of light-receiving parts 12 arranged in a matrix shape in the semiconductor substrate 11 for performing photoelectric conversion; a partition layer 20 arranged above the semiconductor substrate 11 and having openings at regions corresponding to upsides of the light-receiving parts 12, respectively, for partitioning the upsides of the light-receiving parts 12 by the opening and a region between the openings with respect to each light-receiving part 12; and a color filter layer 24 arranged in the opening. The partition layer 20 includes a partition body layer 21, an adhesion layer 22 and a metal layer 23 laminated on the partition body layer 21. The metal layer 23 arranged on top is composed of metal. <P>COPYRIGHT: (C)2013,JPO&INPIT |
