| 摘要 |
<P>PROBLEM TO BE SOLVED: To use hard sealing material such as epoxy based resin as a sealing body for a drive IC, and to suppress curvature of a head substrate, in a thermal print head. <P>SOLUTION: A thermal print head 10 includes a heat radiating plate 20, the head substrate 30, a circuit substrate 40, and the sealing body 56 which is made from, for example, epoxy based resin and stretched between the head substrate 30 and the circuit substrate 40 to seal the drive IC or the like. The head substrate 30 and the circuit substrate 40 are arranged on the heat radiating plate 20, through an adhesive layer. The circuit substrate 40 includes: a flexible substrate divided along a main scanning direction 71, into a first flexible substrate 41a and a second flexible substrate 41b; and a rigid substrate 43. The flexible substrates are attached to a ceramics plate 60. The drive IC is mounted on the flexible substrates. Connectors 46, 47 are mounted to the rigid substrate 43. <P>COPYRIGHT: (C)2013,JPO&INPIT |
