发明名称 RESIN REMOVAL METHOD AND RESIN REMOVAL DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a resin removal method capable of removing resin from the pattern surface of a mold efficiently without causing any damage on the mold. <P>SOLUTION: In an ashing gas atmosphere for removing resin adhering to an original pattern used for imprint, the original pattern is irradiated with ultraviolet light and near-field light is generated in the local region of protrusions and recesses on the original pattern. The resin is removed from the original pattern by using the ashing gas and the near-field light. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012204381(A) 申请公布日期 2012.10.22
申请号 JP20110064671 申请日期 2011.03.23
申请人 TOSHIBA CORP 发明人 CHANG YONG-GANG;MATSUNAWA TETSUAKI;TAKAHASHI MASANORI;KODERA KATSUMASA
分类号 H01L21/027 主分类号 H01L21/027
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