| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a ceramic multilayer substrate whose yield in a manufacturing process can be improved. <P>SOLUTION: The ceramic multilayer substrate 1 includes a ceramic substrate 2 formed by firing a plurality of ceramic green sheets (green sheets 11A, 11B, and 11C), an inner wiring section 7 formed inside the ceramic substrate 2, a recess 5 arranged in a surface of the ceramic substrate 2, a chip electronic component 3 arranged in the recess 5 and electrically connected to the inner wiring section 7, and a metal layer (a first metal layer 16, an external electrode 9 formed with a second metal layer 17, and an electronic circuit pattern wiring section 10) formed on the ceramic substrate 2 by wet plating. Since the ceramic multilayer substrate 1 further includes a glass portion 15 charged from above the chip electronic component 3 in the recess 5, the yield in the manufacturing process of the ceramic multilayer substrate 1 can be improved. <P>COPYRIGHT: (C)2013,JPO&INPIT |
