| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate processing apparatus which can reduce occupied space and time in which the operation is disabled as a whole device to improve throughput in substrate processing. <P>SOLUTION: A substrate processing device comprises: a plurality of vacuum conveyance chambers around each of which a plurality of processing chambers each processing a substrate in a reduced-pressure atmosphere are provided and each having a transfer mechanism inside for carrying in and out a substrate from and to the processing chamber; load lock chambers provided for respective vacuum conveyance chambers; a first atmosphere transfer mechanism transferring a substrate supplied from outside to one of the load lock chambers; and a second atmosphere transfer mechanism receiving the substrate from the first atmosphere transfer mechanism to transfer the received substrate to another one of the load lock chambers. The second atmosphere transfer mechanism is arranged on an upper side or a lower side of the vacuum transfer chamber provided with the one load lock chamber. The plurality of vacuum transfer chambers are serially arranged along a transfer direction of the substrate by the second atmosphere transfer mechanism. <P>COPYRIGHT: (C)2013,JPO&INPIT |
