| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device capable of alleviating distortion caused when a wafer is bonded. <P>SOLUTION: A manufacturing method of a semiconductor device comprises: a step of forming a groove in an outer periphery of a chip region on a joint surface of a support substrate; a step of bonding semiconductor substrates respectively having a chip ring in the outer periphery of each chip region inside a dicing line and the support substrate so that the groove is positioned above the chip ring and inside the dicing line; and a step of dicing the bonded semiconductor substrates and the support substrate along the dicing line. <P>COPYRIGHT: (C)2013,JPO&INPIT |
