| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which inhibits cracks of an encapsulation resin and poor filling of the encapsulation resin while thinning a thickness of the encapsulation resin as thin as possible of a non-mounting surface side on which a semiconductor chip is not mounted. <P>SOLUTION: A semiconductor device comprises: a semiconductor chip; inner leads each having a first surface and a second surface opposite to the first surface and mounting the semiconductor chip on the first surface; a first resin part encapsulating the semiconductor chip on the first surface; a second resin part provided on the second surface; outer leads connected with the inner leads and protruding outward from the first and the second resin parts. A width of the second resin part in a first direction that the outer leads protrude is narrower than a width of the first resin part in the first direction. <P>COPYRIGHT: (C)2013,JPO&INPIT |
