发明名称 ELECTRONIC COMPONENT MOUNTING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide an electronic component mounting method which can achieve reduction of tact time by improving work efficiency of a mark recognition camera at the time of mounting an electronic component on a substrate. <P>SOLUTION: An electronic component mounting method comprises: an allowable area storage process of storing an allowable area in a camera view field, in which reading information from a mark is allowed; a farther end edge calculation process of calculating, for the current camera position, an X direction end edge and a Y direction end edge of a periphery part of an imaging object mark to be imaged next on a farther side with respect to a current camera position among X direction both end edges and Y direction end edges of the periphery part; and a camera movement process of moving the mark recognition camera such that an X direction end edge and a Y direction end edge of the allowable area at the camera position on a side nearer to the imaging object mark to be imaged next among X direct both end edges and Y direct both end edges of the allowable area for the imaging object mark at least cross over the X direction end edge and the Y direction end edge on the farther side to the farther side with respect to the current camera position. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012204743(A) 申请公布日期 2012.10.22
申请号 JP20110069843 申请日期 2011.03.28
申请人 FUJI MACH MFG CO LTD 发明人 OYAMA SHIGEHITO;IIZAKA ATSUSHI
分类号 H05K13/04 主分类号 H05K13/04
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