| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a device and a method for cutting a brittle plate capable of cutting a large-area brittle plate. <P>SOLUTION: This method for cutting a brittle plate has the first step for supporting the brittle plate 2 by a support means 20, and the second step for heating locally the brittle plate 2 supported by the support means 20, moving a heating region of the brittle plate 2 to form a crack penetrating the brittle plate 2 in the plate thickness direction, and extending the crack. In the first step, the brittle plate 2 is supported by the support means 20 in the state where at least a part of the brittle plate 2 is bent and deformed so that a tensile stress works on a cutting-supposed line on the brittle plate surface 2a. <P>COPYRIGHT: (C)2013,JPO&INPIT |
