发明名称 SOLDERLESS INBUILT CONNECTOR OF LIGHT DIODE ASSEMBLY AND HEAT SINK FOR LIGHT DIODE
摘要 FIELD: electricity. ^ SUBSTANCE: design of a light diode assembly comprises at least one light diode crystal; an auxiliary head, having electrodes, at the same time at least one light diode crystal is installed on the auxiliary head; a moulded body of the light diode assembly formed from an electric insulation material; a metal core passing through the body and built into the body during moulding, besides, the upper and lower surfaces of the core are open via the body part, and the auxiliary head is installed on the upper surface of the core so that at least one light diode crystal is electrically insulated from the core and thermally connected with the core; solderless metal connecting leads built into the body during moulding, at the same time connecting leads are electrically connected with electrodes of the auxiliary head for supply of energy to at least one light diode crystal, besides, connecting leads are configured for connection with a source of energy without application of soldering; holes for clamping screws formed by design of the light diode assembly configured for strong pressing of the body and the core to the heat-conductive assembly structure by means of clamping screws, so that between the lower surface of the core and the assembly structure there is a thermal link, besides, holes for pressing screws stretch along at least two opposite edges of the moulded plastic body, at the same time the core is between holes for pressing screws; metal eyes on a metal plate stretching towards holes for pressing screws, so that movement of pressing screws downwards results in pressing against eyes to increase thermal contact between the open core and the assembly structure. Also one more version is proposed for a light diode assembly, which does not use the moulded body. ^ EFFECT: development of light diode assemblies of high capacity releasing considerable amount of heat, which simplify electric connection with sources of energy and provide for superb removal of heat from a light diode without soldering. ^ 15 cl, 32 dwg
申请公布号 RU2464671(C2) 申请公布日期 2012.10.20
申请号 RU20100101426 申请日期 2008.06.13
申请人 KONINKLEJKE FILIPS EHLEKTRONIKS, N.V.;FILIPS L'JUMILDZ LAJTING KOMPANI, EHLEHLSI 发明人 UOLL FRANKLIN;STORMBERG PITER;KMITEK DZHEFFRI;FARR MINA;CHZHAN LI
分类号 H01L33/62;H01L33/64 主分类号 H01L33/62
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