| 摘要 |
PURPOSE: A substrate processing apparatus, a program for controlling the same, and a manufacturing method for a semiconductor device are provided to reduce particles attached to a substrate by automatically closing a cover of the substrate. CONSTITUTION: A placement table mounts a substrate receptor receiving a plurality of substrates. A cover opening and closing part opens and closes a cover of the substrate receptor which is placed on the placement table. A substrate transfer device transfers the substrate from the substrate accepter to a process chamber(402). A substrate processing part processes the substrate within the process chamber transferred by the substrate transfer device. A control part controls the cover opening and closing part, the substrate processing part, and the substrate transfer device. |
