发明名称 |
INTERCONNECT STRUCTURE AND METHOD FOR FABRICATING ON-CHIP INTERCONNECT STRUCTURES BY IMAGE REVERSAL |
摘要 |
An interconnect structure includes a patterned and cured dielectric layer located directly on a surface of a patterned permanent antireflective coating. The patterned and cured dielectric layer and the permanent antireflective coating form shaped openings. The shaped openings include an inverse profile which narrows towards a top of the shaped openings. A conductive structure fills the shaped openings wherein the patterned and cured dielectric layer and the permanent antireflective coating each have a conductively filled region. |
申请公布号 |
US2012261828(A1) |
申请公布日期 |
2012.10.18 |
申请号 |
US201113088054 |
申请日期 |
2011.04.15 |
申请人 |
BRUCE ROBERT L.;LIN QINGHUANG;NELSON ALSHAKIM;NITTA SATYANARAYANA V.;PFEIFFER DIRK;RATHORE JITENDRA S.;INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BRUCE ROBERT L.;LIN QINGHUANG;NELSON ALSHAKIM;NITTA SATYANARAYANA V.;PFEIFFER DIRK;RATHORE JITENDRA S. |
分类号 |
H01L21/283;H01L23/48 |
主分类号 |
H01L21/283 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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