| 摘要 |
<p>In the present invention, device size is kept small and an electronic substrate and a power supply are efficiently cooled. A substrate mounting unit (130) is provided to the front surface side of the interior of a housing (100) and, in a state where from among a plurality of electronic substrates (132) the surfaces of the electronic substrates (132) that are adjacent to each other face each other, the plurality of electronic substrates (132) are mounted thereupon. A power supply (160) provided on the rear surface side of the interior of the housing (100), which is the rear surface side of the substrate mounting unit (130), supplies power to the plurality of electronic substrates (132). A power supply fan unit (170), provided on the rear surface side of the power supply (160), sucks in air from outside of the casing (100) through a power supply intake port (131) and discharges the sucked-in air to the rear surface side of the casing (100) through the substrate mounting unit (130) and the power supply (160). The substrate mounting unit (130) is provided with a heat dissipation path (135) which is formed among the plurality of electronic substrates (132) along the non-mounted surfaces of the electronic substrates (132) and which guides the air sucked in by the power supply fan unit (170) to the power supply (160).</p> |
