| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent deterioration of a piezoelectric material due to moisture within the atmosphere and plasma in a semiconductor process and increase an amount of displacement of a piezoelectric element and, at the same time, eliminate constraints of wiring of a dedicated electrode, etc., to achieve and provide a small inkjet head while maintaining high reliability (moisture resistance) and superior ejection characteristics. <P>SOLUTION: In this inkjet head, an insulating film 9 and an insulating film 10 are formed between a dedicated electrode wiring 7 and a lower electrode 4. An insulating film 11 and an insulating film 12 are stacked in an area which includes a forming area of the dedicated electrode wiring 7 excluding a drive signal input section 20. In at least a portion of a forming area of the dedicated liquid chamber 1, there is an area where the insulating film 10 and the insulating film 11 or the insulating films 9-11 are opened. In an area including a forming section of the piezoelectric element 15, the insulating film 9 and the insulating film 12 are formed in the opening area of the insulating film 10 and the insulating film 11, or the insulating film 12 is formed in the opening area of the insulating films 9 to 11. <P>COPYRIGHT: (C)2013,JPO&INPIT |
