| 摘要 |
<P>PROBLEM TO BE SOLVED: To simply form a uniform rough surface having a low degree of roughness that is required for an insulation resin by using an imprint method in a formation method of the insulation resin rough surface of a multilayer printed wiring board formed by alternately laminating conductor layers and insulation resin layers. <P>SOLUTION: A formation method of an insulation resin rough surface includes at least a process (a) where an insulation resin layer is vertically sandwiched by planar molds having fine shapes, a process (b) where the insulation resin layer is pressurized and cured, and a process (c) the molds are peeled off from the insulation resin layer. <P>COPYRIGHT: (C)2013,JPO&INPIT |
