| 摘要 |
A converter unit and an inverter unit respectively have a plurality of SiC MOSFETs and a plurality of SiC Schottky barrier diodes, and an inverter drive unit has a high withstand voltage IC. The configuration components of the converter unit and the inverter unit are thermally connected to a heat dissipating fin block. A wiring board and the heat dissipating fin block are fixed to a base, such as an aluminum board, by means of a screw that penetrates the wiring board and the heat dissipating fin block. The base is placed on the floor of a machine room. The motor main body and a power converter are disposed adjacent to each other in the horizontal direction on the upper surface of the base.
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