| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a foreign matter removal device on a substrate which can prevent re-adhesion of foreign matters by cleaning the surface of the substrate efficiently in a short time regardless of the size of the substrate, and to provide a die bonder equipped with the same. <P>SOLUTION: The foreign matter removal device comprises a pickup device to which a dicing film mounting a die on the surface is fixed, and a collet which sucks the die peeled off from above the dicing film and mounts the die on a circuit board 10 coated with an adhesive, and removes foreign matters on the substrate in order to coat the substrate with the adhesive. The foreign matter removal device includes a cleaning nozzle where the air blowing holes 5d and air suction holes 5e are integrated. <P>COPYRIGHT: (C)2013,JPO&INPIT |
