| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a high frequency communication device which reduces its thickness even if multiple protrusions are provided on a ceiling surface of a shield case and receives and transmits stable signals. <P>SOLUTION: A high frequency communication device includes: a transmitter-receiver circuit board 10 on which a transmitter-receiver circuit processing signals of sub-millimeter waves or millimeter waves is mounted; and a shield case 30 attached so as to cover the transmitter-receiver circuit on the transmitter-receiver circuit board 10. In the high frequency communication device, protrusions 35 cyclically arranged and an electric wave absorption sheet 36 are separately disposed on an inner surface 32a of the shield case 30 which faces the transmitter-receiver circuit board 10. <P>COPYRIGHT: (C)2013,JPO&INPIT |
