发明名称 RESIST COMPOSITION FOR NEGATIVE DEVELOPMENT AND METHOD OF FORMING RESIST PATTERN
摘要 A resist composition for negative development including a base component (A) which exhibits decreased solubility in an organic solvent under the action of acid and an acid generator component (B) which generates acid upon exposure; and the resist composition used in a method of forming a resist pattern which includes: forming a resist film on a substrate using the resist composition; conducting exposure of the resist film; and patterning the resist film by negative development using a developing solution containing the organic solvent to form a resist pattern, wherein the acid generator component (B) contains an acid generator (B1) that generates an acid having a log P value of 2.7 or less and also a pKa value of at least−3.5.
申请公布号 US2012264058(A1) 申请公布日期 2012.10.18
申请号 US201213440090 申请日期 2012.04.05
申请人 UTSUMI YOSHIYUKI;SHIMIZU HIROAKI;TOKYO OHKA KOGYO CO., LTD. 发明人 UTSUMI YOSHIYUKI;SHIMIZU HIROAKI
分类号 G03F7/027;G03F7/004;G03F7/20 主分类号 G03F7/027
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